Menyoroti: 
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                high efficiency wave soldering machine, selective wave soldering machine SMT, PCB depaneling wave soldering machine
                              

Berat:	12kg	Voltase:	220V
ukuran PCB:	50×50～320×250mm	Ketebalan PCB:	0,8～3mm
Panjang pin:	3mm dalam	Tinggi Komponen:	kurang dari 100mm
Tepi substrat:	Lebih dari 3mm	Berat substrat:	maks 5KG
Pembengkokan substrat:	kurang dari 0,5mm	Bahan tungku timah:	Paduan semua titanium
Kapasitas tungku timah:	12kg	Kekuatan tungku timah:	4*500W, 2KW
Daya pemanasan awal:	1kw	Jenis pemanasan awal:	inframerah
Komponen inti:	PLC, Mesin, Bantalan, Gearbox, Motor

Berat:	12kg
Voltase:	220V
ukuran PCB:	50×50～320×250mm
Ketebalan PCB:	0,8～3mm
Panjang pin:	3mm dalam
Tinggi Komponen:	kurang dari 100mm
Tepi substrat:	Lebih dari 3mm
Berat substrat:	maks 5KG
Pembengkokan substrat:	kurang dari 0,5mm
Bahan tungku timah:	Paduan semua titanium
Kapasitas tungku timah:	12kg
Kekuatan tungku timah:	4*500W, 2KW
Daya pemanasan awal:	1kw
Jenis pemanasan awal:	inframerah
Komponen inti:	PLC, Mesin, Bantalan, Gearbox, Motor

YS-320Y/YS-320YT High Efficiency Integrated Selective Wave Soldering Machine for SMT Production Line

YS-320Y/YS-320YT High Efficiency Integrated Selective Wave Soldering Machine

Designed for SMT production lines, this integrated selective wave soldering machine delivers exceptional efficiency and precision for PCB assembly applications.

Technical Specifications

Applicable PCB Board Size	L × W: 50×50 mm to 320×250 mm
Applicable PCB Board Thickness	Substrate thickness: 0.8–3 mm / Pin length: within 3mm
Component Height	Less than 100mm above substrate / Less than 50mm below substrate
Substrate Shape and Conditions	Substrate placement edge: more than 3mm from substrate process edge Maximum weight including components: 5KG Substrate bending: less than 0.5mm

Packaging & Delivery

We provide professional, environmentally friendly, convenient and efficient packaging services to ensure the complete safety of your goods during transit.