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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                High speed hot bar soldering machine, PCB bonding soldering machine, FPC board soldering machine
                              

Berat:	110 kg	Kekuatan:	10 kw
Voltase:	220V/380V	Model:	YSPC-1A
Wilayah kerja:	200*260mm	Kekuatan Ikatan:	3.900N
Kemampuan nada:	0,25mm	Komponen inti:	PLC, Gearbox, Motor, Pompa
Kontrol Suhu:	PID Loop Tertutup	Kontrol tekanan:	Digital dapat diprogram
Waktu Siklus:	Sangat singkat	Tipe Termoda:	Mengapung
Sistem penyelarasan:	Mikrometer/vakum	CCD opsional:	Bingkai, kamera, lensa
Tipe Pengontrol:	berbasis mikroprosesor

Berat:	110 kg
Kekuatan:	10 kw
Voltase:	220V/380V
Model:	YSPC-1A
Wilayah kerja:	200*260mm
Kekuatan Ikatan:	3.900N
Kemampuan nada:	0,25mm
Komponen inti:	PLC, Gearbox, Motor, Pompa
Kontrol Suhu:	PID Loop Tertutup
Kontrol tekanan:	Digital dapat diprogram
Waktu Siklus:	Sangat singkat
Tipe Termoda:	Mengapung
Sistem penyelarasan:	Mikrometer/vakum
CCD opsional:	Bingkai, kamera, lensa
Tipe Pengontrol:	berbasis mikroprosesor

High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board

High Speed Hot Bar Soldering Machine for PCB and FPC Board Bonding

Advanced hot bar soldering system designed for precision bonding of printed circuit boards and flexible printed circuits with exceptional speed and accuracy.

Technical Details

Microprocessor-based controller provides precise and consistent temperature control
Unique pulsed heat thermos offers uniform temperature distribution with fast heating and cool-down
Flexible programmable profiles for targeted idle, preheat and reflow heating
Floating thermos and digital pressure switch ensure optimal pressure distribution across joints
CCD camera system with magnification lens available for fine-pitch positioning

Key Features

Extremely short cycle time with rotary table design
Product loading and unloading during heat sealing process
High quality heat seal application up to 0.25mm pitch
Pneumatic bonding head provides up to 3,900N force
Digital programmable pressure control with LCD display
Closed loop PID temperature control with visible LED display
Bonding cycle triggered by real-time pressure sensor
Floating Thermode ensures consistent pressure and heat transfer
Precision product fixtures with micrometer alignment and vacuum component fixation
Optional CCD alignment module for fine pitch applications
Full microprocessor logic control

Customer Support Advantages

Engineer overseas training for customers
Prompt technical support services
Rapid complaint handling with 30-minute response time
Reliable manufacturing with 15+ experts each having over six years of experience

Technical Specifications