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Rumah > Produk > Mesin depaneling PCB > Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for Board Assembly

Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for Board Assembly

Rincian Produk

Tempat asal: Jiangsu, Tiongkok

Nama merek: YUSH

Ketentuan Pembayaran & Pengiriman

Kuantitas min Order: 1 set

Harga: $8,000 / set

Dapatkan Harga Terbaik
Menyoroti:

Pulse-heated soldering machine for FPC

,

High-precision PCB welding equipment

,

Pulse heat welding for board assembly

Berat:
110 kg
Wilayah kerja:
110mm X 150mm
Toleransi suhu:
+2℃
Tekanan Udara Kerja:
0.5-0.7MPA
Model:
YSPP-1A
Ukuran:
500mm X 750mm X 910mm
Kisaran Suhu:
0-400 ℃
Menekan Waktu:
0-99 detik
Menekan Toleransi:
0,05Mpa
Kekuatan Ikatan:
3.900N
Kemampuan nada:
0,25mm
Komponen inti:
Motor
Kontrol tekanan:
Digital dapat diprogram
Kontrol Suhu:
PID Loop Tertutup
Modul Penyelarasan:
CCD opsional
Berat:
110 kg
Wilayah kerja:
110mm X 150mm
Toleransi suhu:
+2℃
Tekanan Udara Kerja:
0.5-0.7MPA
Model:
YSPP-1A
Ukuran:
500mm X 750mm X 910mm
Kisaran Suhu:
0-400 ℃
Menekan Waktu:
0-99 detik
Menekan Toleransi:
0,05Mpa
Kekuatan Ikatan:
3.900N
Kemampuan nada:
0,25mm
Komponen inti:
Motor
Kontrol tekanan:
Digital dapat diprogram
Kontrol Suhu:
PID Loop Tertutup
Modul Penyelarasan:
CCD opsional
Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for Board Assembly
Pulse-Heated Soldering Machine for FPC to PCB Board
High-precision pulse heat welding equipment for board assembly with advanced thermode technology for reliable FPC to PCB bonding.
Model Specifications: YSPP-1A
  • Accurate tin press without dragging
  • Precise temperature control
  • Fine-pitch positioning capability
  • Digital program pressure control
Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 0 Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 1
Advanced Features
  • Rotary table design enables extremely short cycle times with simultaneous loading/unloading during heat sealing
  • High quality heat seal application up to 0.25mm pitch
  • Pneumatic bonding head provides up to 3,900N force
  • Digital programmable pressure control with LCD display
  • Closed loop PID temperature control with visible LED display
  • Real-time pressure sensor triggered bonding cycle
  • Floating Thermode ensures consistent pressure and heat transfer along flexfoil to LCD and/or PCB
  • Precision product fixtures (2X) with easy exchange, micrometer alignment, and vacuum component fixation
  • Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch applications
  • Full microprocessor logic control for reliable operation
Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 2 Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 3
Technical Parameters
Parameter Specification
Model YSPP-1A
Size 500mm × 750mm × 910mm
Work Air Pressure 0.5-0.7 MPA
Working Area 110mm × 150mm
Temperature Setup 0-400℃
Tolerance of Temperature +2℃
Time of Pressing 0-99s
Tolerance of Pressing 0.05 MPA
Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 4 Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 5
Technology Overview
Hot bar soldering is extremely effective for bonding dissimilar components and parts that are difficult to unite. This pulse bonding technology differs from traditional soldering by using thermode technology based on rapid reflow through pulse heating. The procedure allows materials with low temperature resistance to be soldered at high lead-free temperatures without damaging the flex circuit. The system selectively solders parts by heating them to temperatures that melt adhesives or solder, which then re-solidify to form permanent, reliable bonds.