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Kontak

Kontak: Ms. Eva liu

Telp: 86-0769-88087410

Fax: 86-0769-88087410

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Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for Board Assembly

Rincian Produk

Tempat asal: Jiangsu, Tiongkok

Nama merek: YUSH

Ketentuan Pembayaran & Pengiriman

Kuantitas min Order: 1 set

Harga: $8,000 / set

Dapatkan Harga Terbaik

Rincian Produk

Deskripsi Produk

Menyoroti: 
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                Pulse-heated soldering machine for FPC, High-precision PCB welding equipment, Pulse heat welding for board assembly
                              

Berat:	110 kg	Wilayah kerja:	110mm X 150mm
Toleransi suhu:	+2℃	Tekanan Udara Kerja:	0.5-0.7MPA
Model:	YSPP-1A	Ukuran:	500mm X 750mm X 910mm
Kisaran Suhu:	0-400 ℃	Menekan Waktu:	0-99 detik
Menekan Toleransi:	0,05Mpa	Kekuatan Ikatan:	3.900N
Kemampuan nada:	0,25mm	Komponen inti:	Motor
Kontrol tekanan:	Digital dapat diprogram	Kontrol Suhu:	PID Loop Tertutup
Modul Penyelarasan:	CCD opsional

Berat:	110 kg
Wilayah kerja:	110mm X 150mm
Toleransi suhu:	+2℃
Tekanan Udara Kerja:	0.5-0.7MPA
Model:	YSPP-1A
Ukuran:	500mm X 750mm X 910mm
Kisaran Suhu:	0-400 ℃
Menekan Waktu:	0-99 detik
Menekan Toleransi:	0,05Mpa
Kekuatan Ikatan:	3.900N
Kemampuan nada:	0,25mm
Komponen inti:	Motor
Kontrol tekanan:	Digital dapat diprogram
Kontrol Suhu:	PID Loop Tertutup
Modul Penyelarasan:	CCD opsional

Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for Board Assembly

Pulse-Heated Soldering Machine for FPC to PCB Board

High-precision pulse heat welding equipment for board assembly with advanced thermode technology for reliable FPC to PCB bonding.

Model Specifications: YSPP-1A

Accurate tin press without dragging
Precise temperature control
Fine-pitch positioning capability
Digital program pressure control

Advanced Features

Rotary table design enables extremely short cycle times with simultaneous loading/unloading during heat sealing
High quality heat seal application up to 0.25mm pitch
Pneumatic bonding head provides up to 3,900N force
Digital programmable pressure control with LCD display
Closed loop PID temperature control with visible LED display
Real-time pressure sensor triggered bonding cycle
Floating Thermode ensures consistent pressure and heat transfer along flexfoil to LCD and/or PCB
Precision product fixtures (2X) with easy exchange, micrometer alignment, and vacuum component fixation
Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch applications
Full microprocessor logic control for reliable operation

Technical Parameters

Parameter	Specification
Model	YSPP-1A
Size	500mm × 750mm × 910mm
Work Air Pressure	0.5-0.7 MPA
Working Area	110mm × 150mm
Temperature Setup	0-400℃
Tolerance of Temperature	+2℃
Time of Pressing	0-99s
Tolerance of Pressing	0.05 MPA

Technology Overview

Hot bar soldering is extremely effective for bonding dissimilar components and parts that are difficult to unite. This pulse bonding technology differs from traditional soldering by using thermode technology based on rapid reflow through pulse heating. The procedure allows materials with low temperature resistance to be soldered at high lead-free temperatures without damaging the flex circuit. The system selectively solders parts by heating them to temperatures that melt adhesives or solder, which then re-solidify to form permanent, reliable bonds.

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Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for Board Assembly