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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                PCB laser depaneling machine, FPC UV laser depanelizer, high precision PCB laser cutter
                              

Berat:	1600kg	Merek Laser:	Optowave
kekuatan laser:	10W	Panjang Gelombang Laser:	355 nm
Catu daya:	AC220V	Ketebalan Bahan:	≤1,2 mm
Pemotongan Presisi:	±20 μm	Presisi platform:	±2 μm
Wilayah kerja:	600*450 mm	Kekuatan maksimum:	3kW
Diameter Balok:	20±5 m	suhu lingkungan:	20±2℃
Kelembaban Sekitar:	<60%	Bahan Mesin:	Marmer
Ukuran:	1480mm * 1360mm * 1412 mm

Berat:	1600kg
Merek Laser:	Optowave
kekuatan laser:	10W
Panjang Gelombang Laser:	355 nm
Catu daya:	AC220V
Ketebalan Bahan:	≤1,2 mm
Pemotongan Presisi:	±20 μm
Presisi platform:	±2 μm
Wilayah kerja:	600*450 mm
Kekuatan maksimum:	3kW
Diameter Balok:	20±5 m
suhu lingkungan:	20±2℃
Kelembaban Sekitar:	<60%
Bahan Mesin:	Marmer
Ukuran:	1480mm * 1360mm * 1412 mm

PCB Laser Depanelizer Machine. FPC UV Laser Depaneizer,High Precision Pcb Laser Cutting Equipment

PCB Laser Depanelizer Machine

FPC UV Laser Depanelizer - High Precision PCB Laser Cutting Equipment

Inline Laser Cutting Machine for Flexible Circuit Boards without Stress

Cutting Applications

FPC and related materials
FPC/PCB/Rigid-Flex PCB cutting
Camera module cutting

Key Features

Fast and efficient operation, reducing delivery time
High quality results with no distortion and clean, uniform surfaces
Integration of CNC technology, laser technology, and software technology
High accuracy and high-speed performance

Advantages of Laser PCB Depaneling/Singulation

No mechanical stress on substrates or circuits
No tooling cost or consumables required
Versatile applications with simple setting changes
Fiducial recognition for precise and clean cuts
Optical recognition before depaneling process begins
Ability to depanel virtually any substrate (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc.)
Extraordinary cut quality holding tolerances as small as < 50 microns
No design limitations - ability to cut virtually any size PCB board including complex contours and multidimensional boards

Technical Specifications

Parameter	Specification
Technical Parameters	Main body of laser: 1480mm × 1360mm × 1412mm
Power	AC220 V
Laser Wavelength	355 nm
Laser Source	Optowave 10W (US)
Material Thickness	≤ 1.2 mm
Precision	±20 μm
Platform Accuracy	±2 μm
Working Area	600 × 450 mm
Maximum Power	3 KW
Vibrating Mirror	CTI (US)
Spot Diameter	20 ± 5 μm
Ambient Temperature	20 ± 2 ℃
Ambient Humidity	< 60%
Machine Base	Marble